The Raise3D E3 IDEX printer delivers precise, stable, and high-speed performance, reaching up to 200 mm/s when printing with composite materials and TPU.
The Raise3D E3 IDEX printer delivers precise, stable, and fast prints of up to 200 mm/s for composite materials and TPU, perfect for prototyping and end-use part production. Built for diverse manufacturing needs, the E3 features the Flexible Filament Auxiliary Feeder and composite filament print head, suited for printing TPU, composite materials, and parts with specific surface finishes.
Reshape the boundaries of manufacturing with the E3: Elastic, Engineering-grade, Expandable.
Choose the E3 to:
When equipped with Raise3D’s Flexible Filament Auxiliary Feeder, the E3 3D printer achieves high-speed printing of flexible filaments at up to 200 mm/s – with greater success rates and extended compatibility across a wider range of hardness levels, including TPU-95A, TPU-90A, TPU-80A, and more.
New Raise3D Flexible Filament Auxiliary Feeder
With the optional composite filament print head, the E3 supports a variety of composite filaments, including PET CF, PET GF, and PPS CF. It reliably handles complex prints with these filaments, ensuring a smooth and consistent printing process. Combined with E3’s Pro Ironing feature and the latest Hyper Speed PLA Pro filament, expect highly precise parts with excellent surface finishes.
Raise3D’s E3 is equipped with dual material storage slots with desiccant, filament run-out sensors, and power loss recovery that provides essential safeguards for uninterrupted, long-duration prints. The exceptional printing precision allows the E3 to meet engineering-grade requirements for both functional prototypes and end-use parts. With print speeds of up to 200 mm/s and IDEX capabilities for duplication mode and mirror mode, the E3 enables rapid batch production that ensures a seamless transition from R&D to full-scale manufacturing.
The E3 comes equipped with auto bed leveling that significantly reduces print preparation time while maintaining highly precise prints. With the 9-point leveling, the E3 can support substrate printing* that allows users to print on a flat substrate, unlocking new creative possibilities.
The E3 also features filament run-out sensors and power loss recovery, providing enhanced reliability and peace of mind.
The E3 is compatible with Raise3D’s Flexible Filament Auxiliary Feeder, an auxiliary feeding and buffer system that increases the feed rate of flexible filaments such as TPU. The higher TPU feed rate enables the E3 to print high-quality TPU parts at up to 200 mm/s. The Flexible Filament Auxiliary Feeder also expands E3’s compatibility with more flexible and elastic materials.
The E3 supports a variety of composite filaments, including Raise3D’s latest Hyper Speed PLA Pro Filament.
Experience ultra-fine surface finish prints with the new Pro Ironing feature; a synergy of the E3 printer, the latest Hyper Speed PLA Pro or Industrial PETG ESD filaments, and the slicing profile in ideaMaker. This delivers an improved surface quality comparable to injection molding, with an average roughness (Ra) of less than 2 µm.
The E3 is compatible with all Raise3D filaments, and is compatible with the OMP (Open Material Program), offering broad material versatility. The E3 comes standard with a 0.4 mm nozzle, and supports 0.2 mm, 0.6 mm, 0.8 mm, and 1.0 mm nozzles, meeting a wide range of material requirements and application needs.
The E3 is an IDEX 3D printer that supports multiple print modes including mirror mode, duplication mode, dual-color, and dual-material printing. With a maximum print speed of 200 mm/s and IDEX capabilities, the E3 can double production output by printing identical models simultaneously, maximizing efficiency and throughput.
Furthermore, the IDEX system allows the E3 to print two materials with significantly different printing temperatures. When combined with the Interlocking function in ideaMaker, it enables the seamless printing of dual-material composite models.
The E3 is equipped with two material storage slots with desiccant that keeps both filaments dry, eliminating moisture-related print defects and preventing dimensional distortion caused by continuous high-temperature drying. This ensures higher dimensional accuracy of printed parts.
The E3 uses a sensor to measure the distance at various locations between the nozzle and the print bed to ensure optimal spacing for a higher success rate. This automatic leveling to different surface variations allows improved material adhesion to the bed and overall print quality. With the addition of the 9-point leveling system to the E3, substrate printing* now enables unlimited creativity on flat surfaces.
*The substrate printing is compatible with select materials and substrate types.Featuring the power loss recovery, the E3 prevents a print from failing during a power outage by saving its last position, and resuming the print once power is restored. The filament run-out sensor on the E3’s extruder will not only save the print, but will also alert users when the filament is about to run out during a print.
| Build Volume (W x D x H) |
Single Extruder Print: 330 × 240 × 240 mm (13 × 9.4 × 9.4 inch) Dual Extruder Print: 295 × 240 ×240 mm (11.6 × 9.4 × 9.4 inch) |
|---|---|
| Machine Size (W x D x H) | 607 × 596 × 465 mm (23.9 × 23.5 × 18.3 inch) |
| Net Weight | 33.3 kg (73.4 lbs) |
| Gross Weight(Carton Only) | 42 kg (92.6 lbs) |
| Gross Weight (Carton with Pallet) | 49.5 kg (109.1 lbs) |
| Print Technology | Fused Filament Fabrication (FFF) |
| Print Head System | IDEX Independent Dual Extruders |
| Filament Diameter | 1.75 mm |
| Max Printing Speed | 200 mm/s |
| Max Volumeric Speed | 16 mm3/s |
| Build Plate |
Flexible Double-sided PEI Build Plate (Default) Flexible Steel Plate with BuildTak (Available) |
| Build Plate Leveling | Mesh-leveling with Flatness Detection |
| Heated Bed Material | Silicone |
| Max Build Plate Temperature | 110°C |
| Nozzle Diameter | 0.4 mm (Default), 0.2/ 0.6/ 0.8/ 1.0 mm (Available) |
| Max Nozzle Temperature | 330°C |
| Layer Height |
The E3 is compatible with 0.2, 0.4, 0.6, 0.8 and 1.0 mm nozzles, and the layer height can vary between 0.1-0.5 mm. To achieve stable print results, when using 0.4 mm nozzles, we recommend using a layer height between 0.1-0.3 mm. |
| Surface Roughness Ra | < 2 μm (Hyper Speed PLA Pro Filament, Ironing enabled) |
| Filament Run-out Sensor | Available |
| Filter | HEPA Filter with Activated Charcoal |
| Connectivity | Wi-Fi, LAN, USB port, Live Camera |
| Noise Emission (Acoustic) | < 50 dB (A) When Building |
| Operating Ambient Temperature | 15-30°C, 10-90% RH non-condensing |
| Storage Temperature | -25°C to +55°C, 10-90% RH non-condensing |
| Power Supply Input | 100-240 V AC, 50/ 60 Hz 230 V @ 2 A |
|---|---|
| Power Supply Output | 24V DC, 350 W |
| Raise3D Material |
Hyper Core: PPA CF/ PPA GF/ ABS CF Hyper Speed: PLA/ ABS/ PETG CF/ PET CF/ PLA Pro Industrial: PPA CF/ PPA GF/ PET CF/ PET GF/ PETG ESD/ PET Support/PPA Support/ PPS CF Premium: PLA/ ABS/ ASA/ PETG/ PC/ TPU-95A/ PVA+ |
|---|---|
| Flexible and Elastic Material | When equipped with the Flexible Filament Auxiliary Feeder, the E3 is compatible with TPE (TPU, TPE-A, TPE-S, TPE foam filaments, etc.), Shore (A) hardness between 95A and 80A (e.g. TPU-95A, 90A, 80A), as well as all Shore (D) hardness filaments. |
| Third Party Materials | Supported by Raise3D OMP (Open Material Program)* |
| Slicing Software | IdeaMaker |
|---|---|
| Supported File Types | STL/ OBJ/ 3MF/ OLTP/ STEP/ STP/ IGES/ IGS |
| Support OS | Windows/ macOS/ Linux |
| Machine Code Type | GCODE |
| User Interface | 7-inch Touch Screen |
|---|---|
| Network | Wi-Fi, Ethernet |
| Power Loss Recovery | Available |
| Screen Resolution | 1024 x 600 |
| Motion Controller | Atmel ARM Cortex-M4 120MHz FPU |
| Logic Controller | NXP ARM Cortex-A55 Quad 2 GHz |
| Memory | 2 GB |
| Onboard Flash | 16 GB |
| OS | Embedded Linux |
| Ports | USB 2.0 × 2, Ethernet × 1 |
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