AL (Alumina) Ceramic is perfect for applications involving tooling, casings and housings, and medical devices – able to withstand high temperatures with high strength properties and chemical resistance. Download...
TOUGH is a rigid, robust engineering material with a good combination of strength and elongation. TOUGH can be used to produce end-use parts. Download Technical Datasheet
RG from the Forward AM Ultracur3D® photopolymer resin line is a durable engineering material which can be used to print functional end-use parts. In addition to being biocompatible, it doesn’t...
BMF MED powered by 30 Systems is a rigid amber material for applications requiring biocompatibility, translucency and/or thermal resistance. It provides parts with crisp details, that can be sterilized and...
ST14OO offers high toughness and elongation for applications requiring high flexibility such as snap-fits. Download Technical Datasheet
BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests. Download Technical Datasheet
HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C. Download Technical Datasheet
HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C. Download Technical Datasheet
BIO is a biocompatible resin suitable for non-implantable medical applications. BIO can undergo sterilization and has passed numerous ISO biocompatibility tests. Download Technical Datasheet
HT 200 is a high temperature material that can withstand temperatures up to 200°C with high strength and durability, perfect for end use applications. Download Technical Datasheet
HTL is a high performance engineering material with high strength, rigidity, and heat resistance, able to withstand temperatures up to 114°C. Download Technical Datasheet
Ceramic-Filled Resin with Exceptionally High Stiffness and Temperature Resistance Ultracur3D® RG 3280 is the first composite material we are adding to our rigid product line. Due to the high loading...
Powered by PµSL and based on BMF’s new hybrid resolution technology, the dual resolution microArch D1025 prints in either 10µm or 25µm resolution, or in hybrid mode with both resolutions in the same print...
Introducing the microArch® S230, the newest member of our lineup of micro-precision industrial 3D printers. This cutting-edge iteration of BMF’s top-tier system boasts unparalleled resolution, capable of producing prints with...
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